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All numerical models simulating dynamic crack growth must incorporate a scheme for extending the crack. For example, in FEM, a node is released in the crack plane or in explicit MPM cracks the crack path is extended by a small amount [15,16]. Even in cohesive zone modelling, a crack grows when the crack opening displacement at the crack root reaches the cohesive law's critical value (δc) and traction drops to zero. In computational mechanics code that correctly conserves total energy, all these virtual crack extensions can cause an increase in kinetic energy that can quickly deteriorate numerical results. But, this conversion to kinetic energy does not reflect crack extension in real materials where that energy is instead absorbed by some surface processes representing the material's fracture toughness. One solution to dealing with artefacts in dynamic crack propagation simulations is to add damping to mimic energy absorption in real materials, but it is challenging to add realistic damping. In previous orthogonal cutting simulations, it was noted that a new form of damping, denoted as PIC damping [11], worked very well for crack propagation simulations. In brief, this damping focuses damping effects in regions with high velocity gradients and, therefore, selectively dampens regions around a propagating crack tip. Simulations with PIC damping enabled are extremely stable for all cutting conditions, while simulations without PIC damping were only stable for a few conditions. When they both work, they give nearly identical cutting forces except for far less noise when using PIC damping. All simulations here used the PIC damping method [11]. 2ff7e9595c
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